| abstract |
The objective of this invention is to provide a type of semiconductor device enabling highly reliable flip chip connection. Semiconductor chip for flip chip assembly has gold stud bumps on a principal surface having a semiconductor integrated circuit formed on it, and the gold stud bumps contain silver (Ag). It is preferred that the silver content be 17%±2% by weight. The gold stud bumps are connected via solder bumps to Cu electrodes on substrate. Because silver is contained in gold stud bumps, it is possible to suppress the generation of voids and cracks in the joint between gold stud bumps and Cu electrodes. |