| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-98 |
| filingDate |
2004-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_226b0623e1fd46157094502505e2f94b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b724234227da56966755eadf712aca5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4641f923c36f4e15511cdb4a4c95b360 |
| publicationDate |
2007-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007117258-A1 |
| titleOfInvention |
Method for the molecular bonding of microelectronic components to a polymer film |
| abstract |
A method for direct molecular adhesion of an electronic compound ( 6 ) on a polymer ( 4 ) is described. The polymer ( 4 ) is coated with a bonding layer ( 5 ), for example silicon oxide, which enables the problems caused by the presence of hydrocarbons to be overcome. The method makes it possible to produce adhesive-free three-dimensional structures ( 10 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11081463-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015155331-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012006463-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I426555-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9123631-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7981238-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818614-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8475612-B2 |
| priorityDate |
2003-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |