http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007111428-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5852eeae645a65a46666203407d934e5
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7378
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8249
filingDate 2005-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64307c6400c553e4498b4d551ecee48b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc1883151a9914082a1831ac02286f23
publicationDate 2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007111428-A1
titleOfInvention Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement
abstract A method for fabricating a heterojunction bipolar transistor (HBT) is provided. The method includes providing a substrate including a collector region; forming a compound base region over the collector region; forming a cap layer overlying the compound base region including doping the cap layer with a pre-determined percentage of at least one element associated with the compound base region; and forming an emitter region over the cap layer.
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