abstract |
It is a soldering method for bonding, by solder, each bonding pad formed on respective bonding targets to be bonded to each other. The method comprises the steps of: a pad heating step for irradiating heating beams while the solder is placed on irradiation paths of the heating beams in such a manner that each bonding pad is heated before the solder is melted; and a solder melting step for melting the solder by the heating beams to be attached on each bonding pad, wherein the heating beams are irradiated almost simultaneously in the pad heating step and the solder melting step, and a molten solder heating step is provided thereafter for further heating the molten solder on the bonding pads by the heating beams. |