| abstract |
The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: n (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×10 4 or greater, represented by an average composition formula: n nR 1 a (OX) b SiO (4−a−b)/2 n n(wherein, R 1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR 2 R 3 R 4 (wherein, R 2 to R 4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0<b<2, and a+b satisfies 1.00<a+b<2), and n(ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. |