| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efbfdc7316d3b1b7ceaee5366a61b6e0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24C1-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B9-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-46 |
| filingDate |
2006-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afca720084ae528ad9f008ea4a6765b5 |
| publicationDate |
2007-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007082460-A1 |
| titleOfInvention |
Wafer processing method and wafer processing apparatus |
| abstract |
A method of processing a wafer includes a masking process for providing a mask on a surface of a film-formed wafer except for a wafer peripheral portion, and polishing process for spraying a processing liquid containing an inorganic material onto the wafer peripheral portion. According to the method of processing a wafer, it is possible to easily remove impurities existing on a wafer peripheral portion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014331917-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113182971-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9920450-B2 |
| priorityDate |
2005-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |