| abstract |
An aqueous resin solution S that comprises an alkali or earth alkali, preferably lithium, sulphamate, hydrogen sulphite, or sulphite, at least one aminoplast resin A, and a curing agent C for the latter, wherein the sulphamate, hydrogen sulphite, or sulphite is present in at least one form of admixed to, and cocondensed within, the at least one aminoplast resin, a method of use thereof to reduce the surface resistance of laminates comprising impregnating at least one layer which is laminated to the surface of the board facing the use side of the said laminates, and laminates obtained by this process |