| abstract |
A latent curing agent for an epoxy resin containing a curing agent (A) for an epoxy resin and a resin coating said curing agent (A) for an epoxy resin, wherein the resin coating said curing agent (A) for an epoxy resin comprises a structure in which two of the structure (structure (1)) are bonded via a urea bonding, the structure (1) being obtained by bonding three sulfur atoms at a branching point via a linear or cyclic aliphatic hydrocarbon group optionally containing an ester structure, wherein at least one of nitrogen atoms of each structure (1) is incorporated into said urea bonding; and a one component epoxy resin composition using the latent curing agent. The above one component epoxy resin composition which can exhibit high curability and storage stability in combination. The above latent curing agent can suitably used for producing the one component epoxy resin composition, which can provide an anisotropic electroconductive material, an electroconductive adhesive material, an insulating adhesive material, a sealing material or the like which exhibits high storage stability, and also exhibits high adhesion reliability and adhesive strength and high sealability. |