http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007052098-A1

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filingDate 2005-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90a92ffe4f28eadebd1abf2d66d371ab
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publicationDate 2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007052098-A1
titleOfInvention Metal line for a semiconductor device and fabrication method thereof
abstract A metal line, which can be used in a semiconductor device structure less than 65 nm in size by forming a barrier metal of an anti-diffusion layer for a copper line using CVD TiSiN, and a fabrication method thereof are provided. The metal line includes: a semiconductor substrate having a semiconductor device formed thereon; an insulating layer which has a contact hole at a portion corresponding to the semiconductor device and is formed on the semiconductor substrate; a TiSiN barrier metal layer which is formed in the contact hole; and a copper line which is formed on the TiSiN barrier metal layer.
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priorityDate 2005-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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