| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c382d63083bf9c158816174ebeb5f9bc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfc8605783539bb04d3cdc95876a674e |
| publicationDate |
2007-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007045823-A1 |
| titleOfInvention |
Thermally conductive thermoplastics for die-level packaging of microelectronics |
| abstract |
A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8299159-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8741998-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8487042-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008153959-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2257978-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013247361-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8472196-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8552101-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011040007-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010063192-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012014069-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015284618-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10287473-B2 |
| priorityDate |
2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |