http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007045778-A1

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filingDate 2006-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07aac8b7a1307e14a982a27d97d70f42
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publicationDate 2007-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007045778-A1
titleOfInvention Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit
abstract A wafer holder for a wafer prober, a heater unit including the same, and a wafer prober including the heater unit are provided in which deformation or breakage of a chuck top can be prevented and proper measurement can be realized even in repeated use. A wafer holder in the present invention includes a chuck top having a chuck top conductive layer on a surface thereof and a support body supporting the chuck top. The chuck top and the support body are fixed to each other by a screw. The difference of thermal expansion coefficient between the screw and the chuck top is 5.0×10 −6 /K or less.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3223305-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012038384-A1
priorityDate 2005-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.