| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-977 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ac59bc4b1a0b212a2a013a5cfdf50d0 |
| publicationDate |
2007-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007042595-A1 |
| titleOfInvention |
Packaging of electronic chips with air-bridge structures |
| abstract |
A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of vaporization temperatures. The plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. To fabricate the circuit assembly, a support structure, including interstices, is formed on an electronic chip. The interstices of the support structure are filled with a material having a vaporization temperature that is less than the vaporization temperature of the support structure. Conductive structures are embedded in the support structure and the material, and a connective structure is mounted on the support structure. Finally, the material is removed from the interstices by heating the circuit assembly. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7492042-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7485497-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7489034-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006244112-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006046322-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7300821-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008048314-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008057629-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005029663-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007023894-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005026351-A1 |
| priorityDate |
1999-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |