| abstract |
An insulating film-forming composition comprising: at least one of a compound represented by formula (1) as defined in the specification, a hydrolysate and a condensate thereof; and at least one solvent, wherein the at least one solvent contains an organic solvent(s) having a boiling point of 85 to 250° C. in an amount of 25 mass % or more; a method for producing an insulating film by using the composition; and the insulating film. |