| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_396880bd01f57c49e22af7411a8714ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bbb496f78c95d698874adf794ace6815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f97fcc61ce82efbf01c12e44dd24b3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24612 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C13-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C13-0016 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ae83bb534eda30382af0fb8b1c667d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0bb6b07078384b37ee593333f24784d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25542c398aa647b3b53dec899d9707b8 |
| publicationDate |
2007-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007003737-A1 |
| titleOfInvention |
Polymer to gold adhesion improvement by chemical and mechanical gold surface roughening |
| abstract |
Polymer electronics devices having reliable electrical contacts and methods of their fabrication are described. A surface of a conductive layer is modified, and a layer of polymer is formed on a modified surface of the conductive layer to create an electrical contact between the conductive layer and the layer of polymer. The electrical contact is created without adding an adhesion promoter. Modifying the surface of the conductive layer increases surface area of conductive layer and therefore improves polymer to conductive layer adhesion while preserving an original chemistry of the surface of the conductive layer. The modified surface of the conductive layer may be formed by mechanical roughening, chemical roughening, or both. The conductive layer forming the electrical contact to the polymer includes a noble metal. The polymer may be spin coated over the modified surface of the conductive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017200711-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7579070-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102007055018-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007048514-A1 |
| priorityDate |
2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |