http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006287465-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7962109cd4763907b82b66760cd0ae8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-683 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0722cb81a09271d9bce43db3893eafd3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eab877b91342d3f5e92dce5e21f8a68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54f6999ebe82f096537135684f9acf46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5720485c3edf6d4d2c007fc29cde0fc0 |
| publicationDate | 2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2006287465-A1 |
| titleOfInvention | Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| abstract | The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH 2 )n, wherein n is 0, 1, 2 or 3, and R 1 to R 8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10851201-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9790241-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010330287-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9416271-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8975318-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016145274-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018142058-A1 |
| priorityDate | 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 484.