| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2ed82c06ec082496ac8b7bfee1f0389a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ea3f8a0a665a4449caab19fd393d3b86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_603e2b1a5d07ef94bbe2aa76d47a0be5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2006-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1f4fe892206679670e3ecec7f3ecaa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20317c37f81ad9cbdb385b056796f923
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec06add30022a96949be27984177e06a |
| publicationDate |
2006-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006251873-A1 |
| titleOfInvention |
A method of manufacturing a film printed circuit board |
| abstract |
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11044812-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111465220-A |
| priorityDate |
2005-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |