| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd88befbb0169354ac4184c2c2b0af8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4954afb33604bab150a2c4de9a4504c0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46732965377141886010d52e6569cd54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12713b85e67a3a65990bb1d724de7520 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06593
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-74 |
| filingDate |
2005-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21779d8ff25b6a0e6e7943915edc9a29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34b02b2cc4fd21970c30e3d532165e3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6894d33efa7c606885997b06b13dffc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9926775ddf62b0640036e7729eddbce2 |
| publicationDate |
2006-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006249826-A1 |
| titleOfInvention |
Multi-chip module and method of manufacture |
| abstract |
A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017170108-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9171819-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I732123-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8183687-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7851256-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008211089-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009111217-A1 |
| priorityDate |
2005-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |