| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20a505080c2490d90f9a96e43edb73f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d376089022cf7943091789ffe59e33c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_707690451dc5560830348559ce7eefcf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce9a91b0fdc1a0ecf17bb3615836bc13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5367dbacd98ec71ce5172474e966ce28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1152dc1e91919d89d64df0e42770d369 |
| publicationDate |
2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006240231-A1 |
| titleOfInvention |
Method for improving the thermal cycled adhesion of thick-film conductors on dielectric |
| abstract |
An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016190359-A1 |
| priorityDate |
2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |