| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2a8248c22a0d87fca1fbcafc080d1e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9cafc86c4919952e1ec4717e7bb253b0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-739 |
| filingDate |
2006-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b54cde53dc68b246835db47fab9d70f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c44c33798befb3d105697d10dd4550b6 |
| publicationDate |
2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006231863-A1 |
| titleOfInvention |
Manufacturing process of a chip package structure |
| abstract |
A manufacturing process of a chip package structure is provided. The manufacturing method uses fine pitch circuit processes, such as a TFT-LCD process or an IC process, to increase layout density and shorten electrical transmission pathways so that a higher electrical performance level is attained. First, a multi-layered interconnection structure with high-density bonding pads and fine pitch circuit is formed over a hard support base plate having a large area and high degree of planarity. A die is attached to a top surface of the multi-layered interconnection structure. A plurality of opening is formed on a bottom surface of the support base plate. Contacts are positioned into the openings in the support base plate such that the contacts are electrically connected to an inner circuit within the multi-layered interconnection structure. |
| priorityDate |
2003-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |