| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d4cfdbcb08c26dbb64bbeed678355ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-18 |
| filingDate |
2005-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98f53c9a50a00739d558d0ea5c32caf9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1753e3a06c4478f73fd8c719aa836a9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0949706ebc80653fff4dd8aa3dae2c2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c890962a21ad4e9eb4e92bd7945d9ff8 |
| publicationDate |
2006-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006228489-A1 |
| titleOfInvention |
Method for manufacturing metallic microstructure |
| abstract |
The present invention discloses a method for forming a metallic microstructure on a patterned surface of a substrate by a nonisothermal deposition (NTID) in an electroless plating solution. The substrate is immersed in the solution being heated by a heating device mounted on a bottom of an electroless plating reactor while the heated solution being cooled by a cooling device provided in the reactor, and thus a seed layer is formed the patterned surface of the substrate. The substrate is then immersed in an electroless plating solution with a back surface of the substrate lying on the bottom of the reactor, so that the exposed seed layer is thickened to form the metallic microstructure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018523756-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006228488-A1 |
| priorityDate |
2005-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |