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inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31b0809858e78a51ba921319559d36fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b30fe88dbf8ff3049fb1d41d3bb947d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9438c54b1551df2b7637bc0cc8892503
publicationDate	2006-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2006220259-A1
titleOfInvention	Multi-chip structure and method of assembling chips
abstract	A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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