| abstract |
The present invention relates to aromatic polyether resins crosslinked with amic acid or imide side chain, and more particularly, to the aromatic polyether resin crosslinked by amic acid or imide side chain, which is produced by heat curing of amic acid, wherein introduction of imide groups to the basic backbone provides excellent chemical resistance as well as heat resistance and improves surface roughness when coated as a thin film so that it can be suitable for films and flexible display plate substrate. |