| abstract |
A method of plating on a glass base plate is disclosed. The method allows a plating film to be formed on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method, even to a thickness of 1 μm or more. Before forming the plating film by electroless plating, a series of surface treatments are conducted on the surface of the base plate composed of a glass material. The surface treatments comprises at least a glass activation treatment, a silane coupling agent treatment, a palladium catalyst treatment, a palladium bonding treatment, ab electroless plating to form a preliminary plating film having a thickness in the range of 0.02 μm to 0.5 μm, and an annealing at a temperature in the range of 200° C. to 350° C. |