http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006199345-A1

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filingDate 2005-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b64258efe02218f862efecdf8264dcc3
publicationDate 2006-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006199345-A1
titleOfInvention Method for manufacturing field effect transistor
abstract The manufacturing stability can be improved while effectively inhibiting the short-channel effect in the transistor according to the present invention. A halo impurity having a conductivity type opposite to a first conductivity type of a first impurity is ion-implanted into the silicon substrate 101, and thereafter the first impurity having the first conductivity type, is ion-implanted and then a flash lamp annealing is conducted to form a p-type halo region 113 and a n-type extension region 111. Then, the second impurity having the first conductivity type is ion-implanted into the silicon substrate 101, and then a flash lamp annealing is conducted to form a n-type source/drain region 109. Then, the impurity contained in the silicon substrate 101 is activated via spike RTA.
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priorityDate 2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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