| abstract |
The present invention relates to a RF module and a fabrication method thereof, wherein the packaging steps of a SAW component and a module is carried out simultaneously, thereby simplifying the fabrication process and reducing the size of the module. In the invention, a chip component is mounted on a substrate having component-connecting patterns thereon, and a SAW component in a bare chip is flip-bonded to the substrate. Thereafter, the SAW component is selectively laminated with a film and then molded; or the SAW component and the chip component are laminated as a whole and metal-plated, without any molding; or a metal wall is disposed between the substrate and the SAW component and then molded. As a result, this reduces the size of the RF modules, and simplifies the fabrication process, thereby benefiting from a cost-saving effect. |