| abstract |
A process for easily and efficiently forming a silica-based coating film having a film thickness of from 0.5 to 5 μm on a substrate, such a coating film, a coating fluid to be used for forming such a coating film, and a process for producing such a coating fluid, are presented. n The present invention provides a process for forming a silica-based coating film, characterized by heating a reaction mixture comprising a silicon compound (A) represented by Si(OR) 4 and/or a silicon compound (B) represented by R 1 n Si (OR 2 ) 4-n (wherein n is an integer of from 1 to 3), an alcohol (C) represented by R 3 CH 2 OH and oxalic acid (D) in specific ratios, at a temperature of from 50 to 180° C. in the absence of water, to form a solution of a polysiloxane having a number average molecular weight, as calculated as polystyrene, of from 2,000 to 15,000, applying a coating fluid containing such a solution on a substrate surface, and thermally curing a coating film obtained by such coating, at a temperature of from 80 to 600° C., and such a coating film having a film thickness of from 0.5 to 5 μm, a coating fluid to be used for such a coating film, and a process for producing such a coating fluid. |