| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B60R2011-0014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B60R7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5223 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-94 |
| filingDate |
2006-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7478f5f7785fb6bd8ddcb648b1a6ab44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25afd567a73dc4ee07d3f631180905e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb9109cde37e9731a5d3435de2d621b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09257fbb94f768492cf1f43b6a8abeee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e910f35c8371011a8954c4c263ca146e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd48bab1b7d9e12bedf93f2993f244e2 |
| publicationDate |
2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006163640-A1 |
| titleOfInvention |
Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method |
| abstract |
In a method of fabricating a metal-insulator-metal (MIM) capacitor and a metal-insulator-metal (MIM) capacitor fabricated according to the method, the method comprises: forming an insulating-layer pattern on a semiconductor substrate, the insulating-layer pattern having a plurality of openings that respectively define areas where capacitor cells are to be formed; forming a lower electrode conductive layer on the insulating-layer pattern and on the semiconductor substrate; forming a first sacrificial layer that fills the openings on the lower electrode conductive layer; forming a second sacrificial layer on of the first sacrificial layer; planarizing the second sacrificial layer; exposing an upper surface of the lower electrode conductive layer; removing the exposed lower electrode conductive layer to form a plurality of lower electrodes that are separated from each other, each corresponding to a capacitor cell; and forming dielectric layers and upper electrodes, that are separated from each other, each corresponding to a capacitor cell, on each of the lower electrodes to provide a plurality of MIM capacitor cells constituting one capacitor to which the same electric signal is applied. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I502684-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8664076-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013207242-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8445353-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7585754-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9741817-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013070221-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112011105831-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8927426-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009181542-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7510944-B1 |
| priorityDate |
2005-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |