| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-00 |
| filingDate |
2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12efe9065f7a39b2fc5b28b18610d874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_488d0ad708fabf6ebcbaafe267509152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3c7276b152a1baac26c7bdcef9b64a2 |
| publicationDate |
2006-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006135653-A1 |
| titleOfInvention |
Electronic molding composition and method |
| abstract |
A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007095368-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I496168-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10294341-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006135704-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011147672-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115417986-A |
| priorityDate |
2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |