| abstract |
A chip fabricating process with the following steps is provided. Firstly, an under ball metal (UBM) layer is formed on a plurality of bump pads and wire pads of a wafer. Then, a portion of the thickness of the UBM layer on the wire pads is removed so as to form a metal lining on the wire pads. Then, a bump is formed on the UBM layer of each bump pad. At last, the wafer is cut into a plurality of chip structures, and each chip structure includes a portion of the bump pads and the wire pads. Therefore, the present invention can fabricate the chip structure with two kinds of pads. Moreover, the present invention also discloses a chip structure and a wafer structure. |