http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006128146-A1

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filingDate 2005-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006128146-A1
titleOfInvention Method of forming barrier layer and method of fabricating interconnect
abstract A method of fabricating a barrier layer is described. A material layer having an opening formed therein is provided. Then, the material layer is disposed inside a physical vapor deposition chamber and a first deposition process is performed to form a first barrier layer on the surface of the opening. The first deposition process includes turning on a plasma source and turning off the plasma source. The turning on of the plasma source and the turning off of the plasma source are separated from each other by an interval less than 2 seconds. Thereafter, the first deposition process is repeated several times to form a second barrier layer comprising a plurality of first barrier layers.
priorityDate 2004-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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