| abstract |
A circuit board 3 includes a ceramic substrate 6 with an internal layer circuit 7 therein. The internal layer circuit 7 is used to electroplate a plurality of component electrodes 8 , a plurality of terminal electrodes 9 , and a loop electrode 10 that surrounds the component electrodes 8 on surfaces of the substrate 6 by using the internal layer circuit 7 . A hole is bored in a periphery of the substrate 6 to sever the internal layer circuit 7 and isolate the component electrodes 8 from the loop electrode 10 . Part of the severed internal layer circuit 7 is then used to electroplate a surface of the loop electrode 10 with a brazing material 5 to provide the circuit board 3. |