| abstract |
Disclosed is a parallel multilayer printed circuit board (MLB), in which conductivity is provided to a through hole, formed through an interlayer connection layer, using a pair of via posts formed on circuit layers, and a method of fabricating the same. The parallel MLB comprises insulating layers through which a plurality of through holes is formed. A pair of circuit layers is laminated on the insulating layers. The via posts, made of a conductive material, protrude from the circuit layers such that the via posts correspond in position to the through holes of the insulating layers, and are in contact with each other to provide interlayer connection. |