| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7bb18ea2da2323c96c3dd50c0f3eb28a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2004-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_322934bdaecd0a93bbe02cb1bb7e1fc2 |
| publicationDate |
2006-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006120015-A1 |
| titleOfInvention |
Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards |
| abstract |
A method of embedding thick-film capacitors includes etching foil electrodes outside the boundary of the capacitor dielectric to prevent etching solutions from coming in contact with and damaging the capacitor dielectric layers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008127470-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9226399-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016330839-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9924597-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011061921-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10524360-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007177331-A1 |
| priorityDate |
2004-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |