| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21D39-00 |
| filingDate |
2005-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fae70f36484b5f59dc539e5e9dcfb9cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afe52f0648123cd3f9ee45d49d47122b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_851e9a425f4e3d5f3a4a720abc9ccb24 |
| publicationDate |
2006-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006115671-A1 |
| titleOfInvention |
Copper-clad laminate |
| abstract |
This invention relate to a copper-clad laminate with good adhesion between a copper foil and a layer of polyimide resin useful for high-density printed wiring boards. The copper-clad laminate having a copper foil treated with a heterocyclic compound containing nitrogen and sulfur as an organic surface treating agent and a layer of polyimide resin satisfying either of the following requirements: the concentration of sulfur atoms derived from the organic surface treating agent in the interface of copper and polyimide is in the range of 0.01-0.24 wt % as determined by an Energy dispersive X-ray spectroscopy (EDX); the weight of sulfur atoms derived from the organic surface treating agent per unit area of the copper foil is in the range of 2.5-3.1 mg/m 2 ; and the concentration of sulfur atoms derived from the organic surface treating agent existing in the range from the surface to a depth of 16 nm of the copper foil is in the range of 1.73-2.30 atom % as determined by X-ray photoelectron spectroscopy (XPS). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010323099-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010115774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8945298-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102388683-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2240005-A1 |
| priorityDate |
2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |