| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2004-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a7b7f842f50edb4de878c60ba341df6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_640a0f7f091c084547d30a39a3bbf532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9dcef621d22e88b373e3cbf30ea6eca |
| publicationDate |
2006-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006110901-A1 |
| titleOfInvention |
Minimizing resist poisoning in the manufacture of semiconductor devices |
| abstract |
The present invention provides a method for manufacturing an interconnect and a method for manufacturing an integrated circuit including the interconnect. The method of manufacturing an interconnect, among other steps, includes forming a via ( 160 ) in a substrate ( 130 ) and then forming a base getter material ( 210 ) in the via ( 160 ). The method further includes forming a photoresist layer ( 410 ) over the base getter material ( 210 ), the photoresist layer ( 410 ) having an opening ( 420 ) therein positioned over the via ( 160 ), and etching a trench ( 510 ) into the substrate ( 130 ) using the opening ( 420 ) in the photoresist layer ( 410 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008079794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7786586-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008153282-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019265590-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10698317-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009057824-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11269256-B2 |
| priorityDate |
2004-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |