| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7d2dedd72617c4a012339fe37347d27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_da38e2388c4c1ccf0b77aaf047bd3920 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-00 |
| filingDate |
2004-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3562db199e246b9ba84572ef1770cd62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcee1c1daa4aa133e415c5076637e056 |
| publicationDate |
2006-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006091495-A1 |
| titleOfInvention |
Ceramic thin film on base metal electrode |
| abstract |
A method including forming a first metal material layer on a dielectric material; transitioning a portion of the first metal material adjacent to the dielectric to a first oxidation state and a portion of the metal material peripheral to the dielectric material to a second different oxidation state; and forming a second metal material layer on the first metal material. An apparatus including an interposer substrate including an adhesion layer including a metal material having respective portions including at least two different oxidation states; and a capacitor on the adhesion layer. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through an interposer including an interposer substrate, a capacitor, and an adhesion layer between the interposer substrate and the capacitor, the adhesion layer including a metal material having respective portions including at least two different oxidation states. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012074562-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008239620-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7710709-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7572709-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7781889-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008145622-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009273057-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008001286-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8003479-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010244275-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007065973-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8809695-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8618593-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7679926-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007222030-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7687366-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009050356-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8143697-B2 |
| priorityDate |
2004-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |