| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e74dde99e639267de12697a55e3d947d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_698e47d4718df7c48cc35b2314b5a2e2 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 |
| filingDate |
2005-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e4180f32c51b688e7d6fa2f77456b8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29f334ec1358a302f7a272d4c8799ce8 |
| publicationDate |
2006-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006086618-A1 |
| titleOfInvention |
Method and apparatus for forming interconnects |
| abstract |
An interconnects-forming method can form a film of interconnect material, having a sufficient adhesion, by electroplating uniformly on an entire surface of a substrate and thus can form highly-reliable embedded interconnects even when the design rule is strict, and which can remove an extra interconnect material at a lower pressure. The interconnects-forming method, including: forming a conductive film on a surface of a substrate having interconnect recesses formed in an insulating film, said conductive film being insoluble in an electrolytic plating solution for the formation of a film of an interconnect material; forming a film of the interconnect material by electroplating on a surface of the conductive film serving as a seed film while filling the interconnect recesses with the interconnect material; and removing an extra interconnect material of the film formed on the conductive film, thereby forming interconnects of the interconnect material embedded in the interconnect recesses. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009289365-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021187685-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008132062-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013052368-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010147463-A1 |
| priorityDate |
2004-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |