| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10061144ae84c9e385b66cfc4fda1a5d |
| publicationDate |
2006-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006086055-A1 |
| titleOfInvention |
Metal ion-containing CMP composition and method for using the same |
| abstract |
The invention provides a chemical-mechanical polishing composition comprising an abrasive, metal ions (M) having a M-O—Si bond energy equal to or greater than about 3 kcal/mol, and water. The invention further provides a method for polishing a substrate using the aforementioned chemical-mechanical polishing composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8827771-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10796921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009215269-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11001732-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011183581-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9799532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2324956-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2324956-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013126334-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I547551-B |
| priorityDate |
2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |