| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9270646d39c5cd06c7b76fb38b717e3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beb61c3803c8447fc544fc01efa063c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a84e6f093d5a4c5ff506a1f8d322b4f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dee79e087e109f32b12fb70a129e6e19 |
| publicationDate |
2006-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006063388-A1 |
| titleOfInvention |
Method for using a water vapor treatment to reduce surface charge after metal etching |
| abstract |
The present disclosure provides a method for reducing or eliminating residual surface charge from a wafer during a semiconductor fabrication process. Because metal etching and photo resist ashing may result in a surface charge, performing a wet cleaning process directly after the ashing may increase corrosion to metal surfaces. This corrosion may be caused by an electro-chemical reaction that occurs between the surface charge and a solvent used in the wet cleaning process. To prevent this, the present disclosure introduces a water vapor treatment between the ashing and the wet cleaning processes. The water vapor treatment, which may be performed in-situ, provides an electrically neutral path that carries the surface charge from the surface of the wafer to electrical ground. By reducing or eliminating the surface charge, the water vapor treatment lessens or prevents corrosion to metal areas. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104576512-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017178955-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I770443-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102867778-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699596-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006199393-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109148264-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10453700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006175290-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289323-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005287814-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014295580-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111261550-A |
| priorityDate |
2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |