| abstract |
The present invention relates to a method and apparatus for laser trimming of resistors in semiconductor applications using ultrafast laser pulse from diode pumped or CW pumped solid state mode locked ultrafast pulse laser oscillator without amplification. The invention disclosed has a means to avoid/reduce the cumulative heating effect to avoid machine quality degrading in multi shot ablation. The disclosed invention provides a cost effective and stable system for high volume manufacturing application. The disclosed invention is used for thick and thin film trimming. Ultrafast laser oscillator can be a called as femtosecond laser oscillator or a picosecond laser oscillator depending on the pulse with of the laser beam generated. |