| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-12 |
| filingDate |
2004-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1a9815764f9fc4e295759de4ef5c5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3611205ca0d7b85094d8707f585d0bed |
| publicationDate |
2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006035475-A1 |
| titleOfInvention |
Semiconductor substrate processing apparatus |
| abstract |
According to one aspect of the invention, a semiconductor substrate processing apparatus and a method for processing semiconductor substrates are provided. The semiconductor substrate processing apparatus may include a semiconductor substrate support, a dispense head positioned over the semiconductor substrate support, a liquid container, and a transport subsystem. A semiconductor substrate may be placed on the semiconductor substrate support while a first semiconductor processing liquid is dispensed thereon. The wafer may also be spun by the semiconductor substrate support to remove the first semiconductor processing liquid. The transport subsystem may transport the semiconductor substrate to the liquid container where the semiconductor substrate may be immersed in a second semiconductor processing liquid. The semiconductor substrate may then be removed from the second semiconductor processing liquid while vapor is directed at a surface of the semiconductor substrate where the semiconductor substrate contacts a surface of the second semiconductor processing liquid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006144419-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11139183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7718012-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008268617-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7694688-B2 |
| priorityDate |
2004-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |