http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006028288-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_919966a435d19e23e08e5cac4a3eb832
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-268
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-26
filingDate 2004-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cfec4ecf9a5e57b8f0791a7290c4425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7b1a6fa941a0ea97f3701053b4fb3a7
publicationDate 2006-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006028288-A1
titleOfInvention Ball grid array resistor capacitor network
abstract An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is formed from material on the same side of the substrate as the capacitor. In some versions of the invention, the resistor is formed on top of a substrate dielectric layer. In these versions of the invention, a conductor both functions as one of the capacitor's electrodes and connects the resistor to the capacitor. In alternative versions of the invention, the resistor is formed from a film that disposed on the undersurface a metal foil. The foil functions as the resistor to capacitor conductor. Sections of the foil that are removed expose and define the resistor. Solder balls or other connectors on the substrate surface connect the network to another component.
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priorityDate 2004-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 40.