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filingDate 2005-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36470fc7e6101b7c657612dc0f12430e
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publicationDate 2006-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006024932-A1
titleOfInvention Methods of forming semiconductor devices including removing a thickness of a polysilicon gate layer
abstract Embodiments of the present invention provide methods of forming a semiconductor device including forming a polysilicon layer on a semiconductor substrate and doping the polysilicon layer with P-type impurities. The semiconductor substrate including the polysilicon layer is annealed and then an upper portion having a first thickness of the annealed polysilicon layer doped with the P-type impurities is removed. The first thickness is selected to remove defects formed in the polysilicon layer during doping and/or annealing thereof.
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