| abstract |
A method is provided for forming alloy deposits at selected areas on a receiving substrate, including providing a decal alloy carrier, having alloy loadable areas in selected positions thereof, the alloy loadable areas being adapted to being loaded with an alloy mass, mating the decal alloy carrier with the receiving substrate, so that the alloy loadable areas substantially correspond to the selected areas on the receiving substrate, and reflowing the solder alloy masses so as to cause transfer of the alloy from the alloy loadable areas to selected areas on the receiving substrate, such as solder-affine pads, while ensuring that the decal alloy carrier and the receiving substrate are kept in close contact one to another at least during the reflowing. The alloy loadable areas are preferrably recesses in the decal alloy carrier having flat bottoms, which results in relaxed alignment tolerances. |