| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c521d4ca7856f4c56004103c33eda26f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-00 |
| filingDate |
2005-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7966630f2fb635d7dbb5c2f3c8c8c968 |
| publicationDate |
2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006009615-A1 |
| titleOfInvention |
Polyamic acids, polyimide films and polymide-metal laminates and methods for making same |
| abstract |
A polyamic acid obtained by the reaction of an aromatic diamine containing 1-100 mol percent of a carboxy-4,4′-diaminobiphenyl and an aromatic tetracarboxylic dianhydride or derivative thereof is provided. A polyimide is obtained from the imidization of the polyamic acid. Methods for obtaining the polyamic acid, the polyimide, a polyimide film, and a polyimide film-metal laminate are also disclosed. The polyimide film-metal laminate has a high peel strength of at least 10N/cm when laminated to a metal foil using an adhesive, and as such can generally be used as a flexible circuit substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016003146-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8715541-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11382210-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106536597-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10538665-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010155976-A1 |
| priorityDate |
2004-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |