| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4336 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433 |
| filingDate |
2004-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02ae52c1817691857b5e611c523d9cbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5957ae0d2e22df3563802193beab4998
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00318decd647b3262632f944ad7a0407
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_771a245d5ef991dcefef5ee4f1859461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2482a2e113076dbfa87639e045ead190
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3e70532b429ed9dc23c3f2b93fd8797 |
| publicationDate |
2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005280993-A1 |
| titleOfInvention |
Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins |
| abstract |
An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8266802-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7301770-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009314467-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017023254-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10331182-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11094605-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006126308-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I777883-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10658262-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019168576-A1 |
| priorityDate |
2004-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |