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filingDate 2005-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005279641-A1
titleOfInvention Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
abstract The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
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