| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d1d01f6fc6a8e81cf60813f0693f6cb8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate |
2004-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90929319b9bdab96822fa0bffbde84e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38e1bf2b9ddc98bb9762345bab2fc23c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_935359e99ebf962871d86777007a3df4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4653c665a1bb59fdcaff5d2dd20e6b05 |
| publicationDate |
2005-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005275086-A1 |
| titleOfInvention |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly |
| abstract |
A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connections formed on the substrate using bonding wires. A preformed one-piece integrated mold cap and heatspreader assembly attached to the substrate to enclose at least a portion of the bonding wires and the die. Methods of assembling semiconductor integrated circuit packages using a preformed one-piece integrated mold cap and heatspreader assembly are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008224304-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7719006-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724706-B |
| priorityDate |
2004-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |