patent/US-2005249968-A1

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filingDate	2004-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13f07c1c9c0f113c0fd27a7402e3fb44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_918994dc1dcd7e6bd72e143c069d4816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a801b98e4d63f3893a346ada50d0e93 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c922bc25019b90b7776a648600b1bb54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36e3d680f143f835cbe651a3749b8774
publicationDate	2005-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2005249968-A1
titleOfInvention	Whisker inhibition in tin surfaces of electronic components
abstract	A method for reducing whisker formation in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in thickness.
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type	http://data.epo.org/linked-data/def/patent/Publication

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