| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02234 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate |
2005-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a164e6543a83b4877c835cb71839199f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d47eab4bbc235f5f9a30ef49d8be51ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c90bfa218e79c351cd8eb151f8984fae |
| publicationDate |
2005-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005249480-A1 |
| titleOfInvention |
Optical semiconductor device |
| abstract |
The present invention provides an optical semiconductor device comprising: a wiring circuit board; at least one optical semiconductor element mounted on the wiring circuit board; resin layer A that encapsulates the at least one optical semiconductor element therewith; and resin layer B interposed between the resin layer A and the wiring circuit board, and having a tensile modulus as measured at 30° C. of 0.001 to 0.4 GPa. |
| priorityDate |
2004-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |